VS-TP1501 Thermally Conductive Silicone Potting Compound
Description
VS-TP1501 is a two-component 1:1 heat-curing silicone heat-conductive potting adhesive, which cures at room temperature or after heating to form elastic heat-conductive silicone rubber. It is specially designed for the manufacture of electronic and electrical products and modules, such as the potting protection of high-power power supply modules, frequency converters, sensors, etc., and the connection and fixation between on-board electronic devices and PCBs.
Features
- Operating temperature: -40℃~+200℃
- Excellent mechanical properties and ductility
- Excellent thermal conductivity and aging resistance
- Low viscosity, self-leveling, excellent seam drilling ability
- Low modulus, low stress, good adhesion to metals and plastics
Technical Performance
| Item | Typical value | Test method |
| Mixing ratio | 1:1 | / |
| Color (After mixing) | Grey | Visual inspection |
| Viscosity(Component A) @25℃ | 3000-5000cps | ASTM D2196 |
| Viscosity(Component B) @25℃ | 3000-5000cps | ASTM D2196 |
| Viscosity(After mixing) @25℃ | 3000-5000cps | ASTM D2196 |
| Opening hours@25℃ | ≥60min | / |
| Curing condition | 20min/100℃ 30min/80℃ | / |
| Thermal conductivity | 1.3±0.2 W/m·k | ASTM D5470 |
| Hardness | 50±5 Shore A | GB/T 531.1-2008 |
| Density | 2.2±0.2 g/cm3 | GB/T 1033.1-2008 |
| Tensile strength | ＞0.2 MPa | GB/T 528-2009 |
| Elongation at break | ＞10% | GB/T 528-2009 |
| Flame retardant rating | V-0 | UL94 |
| Breakdown strength | ≥15 kV/mm | GB/T 1695-2005 |
| Volume resistivity | ≥ 1.0×1013 Ω·cm | GB/T 1692-2008 |
Dimensions
| Type | Packing |
| VS-TP1501（1kg） | Component A 0.5kg; Component B 0.5kg |
| VS-TP1501（20kg） | Component A 10kg; Component B 10kg |
| VS-TP1501（40kg） | Component A 20kg; Component B 20kg |
| VS-TP1501（80kg） | Component A 40kg; Component B 40kg |
| VS-TP1501（100kg） | Component A 50kg; Component B 50kg |
- Stirring A and B components separately
- Mixing the well-stirred components A and B at the ratio of 1:1 (either volume ratio/weight ratio can be used)
- The mixed compound is poured into the device to be filled and cured (room temperature or heating can be cured).
Cautions
- In order to ensure the uniform distribution of fillers, component A and component B must be separately stirred before mixing, so that each compound is evenly mixed
- A and B agents will react and cure each other after mixing, so they need to be used after mixing, and can not be used twice after mixing and curing
- When pouring into the protective part, there should be no large debris or other pollutants in the protective part to avoid affecting the adhesion of materials and objects
- Before the material is fully cured, keep other objects away from the material, which may affect the appearance and protective performance of the material
- Keep this product away from the mouth and eyes. If it enters the mouth and eyes accidentally, rinse it with clean water or go to the hospital
- For high thermal conductivity, vacuum defoaming is required prior to perfusion
- In low temperature environment, the curing time will be extended correspondingly
Storage conditions and shelf life
- Products should be stored in the original packaging, keep the lid closed, avoid contamination (temperature: 15℃ < T < 30℃; Relative humidity: RH < 70%)
- The shelf life is 6 months from the production date
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