Description
VS-GP2001silicone thermal pad achieve low interfacial thermal resistance at relatively low pressures, with excellent thermal conductivity, thermal stability, flexibility and resilience, safe and reliable use. Applied between the power device and the cooling aluminum sheet or the machine shell, the air can be effectively excluded to achieve good thermal conductivity filling effect.
Features
Operating temperature: -40℃~+200℃
High thermal conductivity, low thermal resistance
Excellent surface wettability and resilience
Excellent flame retardancy
Multiple thickness selection, wide application range
Environmental protection standards: RoHS, REACH
Technical Performance
| item | Typical Data | Test Standard |
| Standard color | Gray | Visual |
| Density (g/cm3) | 2.0 | GB/T 1033.1-2008 |
| Thickness (mm) | 0.5~5.0 | ASTM D374 |
| Hardness (Shore OO) | 25-70 | GB/T 531.1-2008 |
| Tensile strength (KPa) | ≥40 | GB/T 528-2009 |
| Elongation at break (%) | ≥10 | GB/T 528-2009 |
|
Thermal conductivity (W/m·k) |
2.0 | ASTM D5470 |
| Flame Retardancy | V-0 | UL94 |
|
Dielectric Breakdown Voltage (kV) |
14kV/mm | ASTM D149 |
| Volume resistivity | ≥1.0×10 12 Ω·cm | ASTM D257 |
- Clean the surface of the substrate to be installed before use
- Select products with corresponding specifications based on the dimensions of the installation parts
Cautions
- The environment should be free of large debris or other pollutants to avoid affecting the installation effect and protective performance of the materials
- The specifications of the product should be similar to the dimensions of the installation site. The deviation should not be too large
Storage conditions and Shelf life
Storage Temperature: 0℃~40℃
Relative humidity: RH＜80%
Shelf life: 12 months from the production date
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